Capabilities
One plant from bare board to boxed product, under one quality system.
Three capability families
Each family below carries the two or three parameters that decide whether a build is routine or difficult. Read the hook line, then follow the card into the detail page that matches it.
Lamination, drilling, plating, imaging, solder mask and surface finish in one plant, no outside board shop in the chain. Volume work sits at 2–8 layers; 10–20 layers and HDI are quoted per project; advanced builds run to 58 layers on request. Impedance is held to ±10% standard, ±5% on premium builds, and confirmed by TDR coupons on the panel border. Differential pairs to 100 Ω.
Fabrication detail
Placement reaches 80,000 components per hour on an ASM SIPLACE X4iS line and 72,000 CPH on Yamaha YSM20R heads, with placement accuracy of ±25 µm. Components from 01005 and 0201 passives up to BGA at 0.25 mm pitch; fine pitch to 0.3 mm. Reels, cut tape, tubes, trays and loose parts all load on the same line.
Assembly detail
Bill of materials sourced from an approved pool of more than 5,000 suppliers, parts bought through authorised distribution unless you approve a broker deviation in writing. Conformal coating, potting, cables and sheet metal are added on site, then the unit is assembled, tested and packed for export to 60+ countries.
Turnkey detailConsigned, partial or turnkey
The three models differ in who buys the material, who owns the change order and what arrives on your dock. Picking the wrong one is the most common cause of a re-quote, so the split is set out in full here.
| Dimension | Fully consigned | Partial turnkey | Full turnkey |
|---|---|---|---|
| Input files | Gerber RS-274X, BOM, pick-and-place, plus the parts themselves | Gerber RS-274X, BOM and pick-and-place; you nominate which lines you supply | Gerber RS-274X, BOM and pick-and-place, ODB++ and IPC-2581 also accepted |
| Material owner | You | Split by line item, agreed before the purchase order | Saturn PCBA, through 5,000+ approved suppliers |
| Deliverable | Assembled and tested boards, returned in ESD shielding bags | Assembled and tested boards with the supplied parts consumed per the agreed split | Boards, coating, cables, enclosure and a packed finished unit |
| Minimum quantity | 1 piece | 1 piece | 1 piece, no MOQ on any model |
| Change responsibility | Part substitutions and shortages are yours; we report them in writing | Split by line item, recorded on the approved BOM revision | Ours, but no part is substituted without your written approval |
| Typical scenario | An existing line already holds stock and only needs capacity | Long-lead semiconductors are already on your shelf | A new product with no procurement team in Shenzhen |
Parameter hooks
If your design sits inside every cell below, the build is routine for this plant. If one of them is outside, the engineering review in the quotation will say so before you commit to tooling.
One-stop chain
Every stage below happens on the same site in Xixiang, Shenzhen. Nothing is outsourced to a second board shop or a third-party assembler, which is why a change to the stackup does not restart the commercial conversation.
Engineer reviews the Gerber, BOM and stackup, then returns a free DFM report before any purchase order exists.
Lamination to 58 layers, 2.5 mil lines on HDI, copper 0.5–20 oz, panels to 600 × 1200 mm.
Enclosure tooling, injection moulding and sheet-metal fabrication are coordinated by the same project engineer.
5,000+ approved suppliers, authorised distribution by default, date-code traceability on every reel.
9 SMT lines and 4–5 DIP lines, 3D SPI then 3D AOI on every board, X-ray on a minimum of 5 pieces per lot.
Final assembly, functional test, serialised records, then FOB Shenzhen or FCA Shenzhen Airport to 60+ countries.
Industry entry
Each sector below carries one technical hook that usually decides the supplier. If you recognise the standard or the parameter next to your own product line, open that page for the full requirement matrix.
2–6 oz heavy copper, impedance held to ±10% standard, IPC-CC-830 conformal coating, high-Tg laminate at 170–180 °C, IPC-A-610 Class 3 documentation.
Industrial controlAutomotive-grade process capability with PPAP and IMDS documentation, Tg ≥170 °C laminate, thermal vias under power devices, 6 × 260 °C reflow, −55/+125 °C for 1,000 cycles, IPC-1782A M3 traceability.
AutomotiveMedical-grade process capability with serialisation and full traceability, high-CTI laminate rated ≥400 V, IPC-6012 Class 3, ionic cleanliness ≤1.56 µg/cm², parylene or polyurethane coating above 500 MΩ insulation resistance.
Medical devices8–20+ layers on low-loss laminate, impedance ±10% with a TDR coupon on every lot, back-drilling, and copper weight selected against the 802.3af/at/bt PoE budget.
Telecom & networking4–6 layer FR-4 cost-engineered for single-sided assembly, matched solder-mask colour across production lots, UL 94 V-0 laminate, and no MOQ from 1 piece upward.
Consumer electronics400–800 V DC creepage spacing, 2–6 oz copper, CTI at Material Group I laminate, high-Tg at 180 °C and above, IPC-6012 Class 3 documentation for the qualification file.
Power & energy4–8 layers with 170 °C+ high-Tg laminate, PoE copper weight sized to the load, RS-485 differential pairs with surge protection, relay-driver selection against contact inrush, and serialisation on every unit.
Security & building4–6 layer gateways on 1+N+1 HDI with 0.1 mm microvias, 50 Ω and 100 Ω impedance control to ±10%, RF and digital domains kept 15–20 mm apart, pre-certified module reuse.
IoT & wearablesBoard families in production
Four board families photographed on the bench, all built on the same nine SMT lines and the same inspection gates described above.
1+N+1 HDI with laser microvias at 0.1 mm, 2.5 mil lines and 01005 passives placed at ±25 µm.
Polyimide flex cores bonded to rigid FR-4 islands, copper from 0.5 oz, coverlay and stiffeners bonded before final routing.
Aluminium IMS and copper builds from 3 oz (105 µm) up to 20 oz (700 µm), with thermal relief spokes and 288 °C solder-float screening.
Eight identical circuits per panel with routed breakaway tabs and tooling strips, sized for a 510 × 460 mm conveyor envelope.
Before you send files
These are the commitments that do not change with order size, board class or destination country.
Quotation in 24 hours
You do not have to read the detail pages first. Describe the board or the assembly, and an engineer replies within one working day with a price, a lead-time bracket and a DFM report. NDA on request.
Send your Gerber, BOM or a plain description. An engineer, not a sales script, reviews it and replies within one working day. NDA on request.
