SMT placement
Stencil printing, 3D SPI, placement, reflow and 100% AOI across nine lines, down to 01005 chips and 0.25 mm-pitch BGA.
SMT assembly detail
PCB assembly
PCB assembly: 9 SMT lines, 4–5 DIP lines
Nine surface-mount lines and four to five through-hole lines feeding one inspection chain. 880,000 CPH of placement capability, ±25 µm accuracy, and every board passing 3D AOI before it leaves the floor.
Capacity & precision
The numbers a DFM review actually checks
Every figure below is a machine specification or a floor measurement you can hold us to in a purchase order. Placement rates are quoted as capability, never as a promised daily output.
| Parameter | Figure | Basis |
|---|---|---|
| Placement capability | 80,000 CPH | ASM SIPLACE X4iS, machine placement capability, not guaranteed throughput |
| Second placement platform | 72,000 CPH | Yamaha YSM20R, used for high-mix and changeover-heavy work |
| Placement precision | ±25 µm | Chip and IC placement across both platforms |
| Smallest chip | 01005 | 0201 also standard; µBGA, CSP and PoP in the same window |
| Finest package pitch | BGA to 0.25 mm | Fine pitch to 0.3 mm; QFP, QFN, LGA and CBGA supported |
| Component height | ≤25 mm SMT | Wave soldering accepts top 120 mm / bottom 15 mm |
| Lines and volume | 9 + 4–5 | Nine SMT and four to five DIP lines, 13,000 part numbers per month |
Four assembly services
Pick the route your board actually needs
Most boards pass through more than one of these four. Each card opens the page that carries the process detail, the equipment list and the acceptance criteria for that stage.
THT, wave & selective
Wave soldering, programmable selective soldering, hand soldering and press-fit for mixed-technology boards with tall connectors.
Through-hole detail
Test & inspection
Flying probe, Agilent i3070 in-circuit test with 3,072 points, custom functional fixtures and X-ray on every batch.
Test & inspection detail
Turnkey & box build
Component sourcing, conformal coating, potting, harnesses, sheet metal and final enclosure assembly, shipped as one build.
Turnkey detailAssembly flow
Nine stages, no stage skipped
This is the whole route a mixed-technology board takes on our floor. Each node names the equipment that runs it and the figure that decides whether the board moves on.
Process boundary
SMT or through-hole, where the line changes
Mixed-technology boards cross this boundary twice. Knowing which side a part belongs on is what keeps a quotation accurate: the two routes have different height limits, different solder methods and different inspection gates.
| Parameter | SMT, surface mount | THT, through-hole and wave |
|---|---|---|
| Components placed | 01005 and 0201 chips up to BGA at 0.25 mm pitch, QFN, LGA, CSP, PoP | Connectors, transformers, large electrolytics, relays, press-fit pins |
| Component height | ≤25 mm above the board surface | Top 120 mm / bottom 15 mm through the wave |
| Solder method | Reflow in 8–12 zones, lead-free peak 245–260 °C; leaded and lead-free both run | Wave soldering, programmable selective soldering, hand soldering, press-fit |
| Inspection gate | 3D SPI, then 3D AOI on 100% of boards across all nine lines | Visual criteria to IPC-A-610 Class 2 & 3 workmanship, soldering to J-STD-001 |
| Equipment | ASM SIPLACE X4iS at 80,000 CPH, Yamaha YSM20R at 72,000 CPH, ±25 µm | 4–5 DIP lines; Seho ECOSyS 3000 and ERSA Versaflow 3 for selective work |
| What drives the choice | Density, fine pitch and thermal mass small enough for reflow | Mechanical load, connector retention and heat that reflow cannot reach |
Incoming material & tooling
Send the parts the way you already buy them
There is no repackaging charge hiding in the quotation. Reels, cut tape, tubes, trays, loose parts and bulk bags all load onto the same feeders, and the only files we need from you are a Gerber set, a BOM and a pick-and-place list.
- Reel. The default for series volume; tape width is read straight off the reel label.
- Cut tape, short lengths from a part you already hold, loaded without splicing.
- Tube, for SOIC, SOP and other stick-fed packages on the tray feeder.
- Tray, BGA, QFP and connectors that ship in matrix trays or waffle packs.
- Loose, single parts and leftover stock, counted and re-taped for a run.
- Bulk. Bagged passives for high-volume panel runs and for the DIP insertion stations.
- Laser-cut stainless stencil, the standard aperture route, cut from your paste layer.
- Electroformed stencil, for fine-pitch apertures where a smoother wall releases paste better.
- BOM in Excel or CSV. With manufacturer part numbers, so substitutes can be checked before ordering.
- Pick-and-place in CPL or CSV, plus the assembly drawing when polarity matters.
Commercial terms
What it costs to start
Assembly terms are the part of a quotation that decides whether a prototype programme is viable at all, so the five answers below are the ones buyers ask for first.
- No MOQ. Aa single assembled board is a valid order, and the same nine lines carry a 10,000-piece series without a re-qualification step.
- Consignment or full turnkey, send the parts and we assemble, or hand over the BOM and we buy, kit and assemble against it. Partial consignment is normal.
- Engineering review and quotation within 24 hours, a real review of the Gerber, BOM and CPL, not an automated price table.
- 13,000 part numbers a month. The mix the floor handles, from five-piece prototype panels to series runs, on the same equipment set.
- Shipped to 60+ countries, FOB Shenzhen by sea or FCA Shenzhen Airport by air; boards travel in electrostatic shielding bags inside a moisture-barrier bag with desiccant and a humidity indicator card.
BOM review
The BOM is checked before anything is ordered
Assembly risk usually arrives as a line item, not as a process fault. A buyer reviews every BOM by hand against a pool of more than 5,000 audited suppliers before a purchase order is raised, and flags what will not be there in time.
- End-of-life and allocation warnings come back with the quotation, not three weeks later
- Substitute parts are proposed in writing and only used after your written approval
- DFM feedback covers panelisation, paste apertures and the height of tall through-hole parts
Quotation in 24 hours
Send the BOM, the Gerber and the CPL.
Add the panelisation and any process requirement you already know. An engineer reviews the package and answers with a price, a lead time and the open questions, within 24 hours, no MOQ.
