Nine lines in parallel
Printer, mounter, reflow and AOI on one rail, so a panel never leaves the line between print and inspection.
Shenzhen factory · Bao'an, Xixiang
Inside the Shenzhen factory: 9 SMT lines, 4-5 DIP lines
Our own plant on the 4th Floor, Building 13, Rundongsheng Industrial Zone, 107 National Highway. Nine SMT lines and 4-5 DIP lines run in parallel on one quality system, producing 13,000 part numbers a month.
Equipment inventory
What stands on the floor, section by section
Model names, not adjectives. Every row below is a workshop section with the machines that work in it and the lines those machines are wired to.
| Section | Equipment in the section | Lines and throughput |
|---|---|---|
| Solder-paste printing | GKG stencil printers with vision alignment and squeegee-pressure control; laser-cut and electroformed stencils | 1 per SMT line · 9 SMT lines |
| High-speed placement | Yamaha YS24 and Yamaha YS12 modular mounters; ASM SIPLACE X4iS | 72,000 - 80,000 CPH per line, placement capability |
| Flexible placement | G5 and G9 placement lines for high-mix, quick-changeover work | 2 changeover-heavy lines alongside the volume lines |
| Reflow | Lead-free reflow ovens with operator consoles, 8-12 heating zones | 1 per SMT line · peak 245-260 °C |
| Paste and placement inspection | Koh Young 3D SPI; MENTO MT2000 3D AOI; Omron VT-RNS and SAKI BF-18D 3D AOI | 100% of boards, every SMT line |
| Hidden-joint and first-article inspection | Nordson DAGE XD7600NT digital X-ray cabinet; JCX FAI830 first-article tester | Minimum 5 boards per batch under X-ray |
| Electrical test | Takaya APT-1500F flying probe, 4 heads; Agilent i3070 in-circuit tester; custom FCT fixtures | 3,072 ICT test points; per-board pass/fail records |
| Through-hole and soldering | DIP insertion lines, wave-soldering machines, programmable selective soldering, hand-soldering benches, press-fit | 4-5 DIP lines · component height to 120 mm topside |
| Coating, assembly and pack-out | Conformal-coating and potting stations, ultrasonic plus DI-water cleaning, hand-assembly lines, ESD benches, finished-goods racks | 13,000 part numbers a month across the plant |
Material flow
Nothing moves without a handover record
Components and boards travel one route through the plant, and every handover between the five stages is signed off. Rejected material goes back to the IQC hold area instead of onward to a line.
IQC hold. Incoming bare boards are counted 100%, dimension-checked and
verified against a test coupon; components are checked for production date code,
quantity and solderability before release to stores.
Stores and baking. Reels and trays are held below 40 °C and under
90% RH. Moisture-sensitive parts that have breached floor life go through a
125 °C bake, 9 hours for a saturated MSL 3 part with a body of 1.4 mm or less.
Kitting. One kit, one work order, one handover sheet. Reels, cut tape,
tubes, trays and loose parts are all accepted; the kit is released to a named line
and the remaining balance returns to stores.
In process. 3D SPI sits before placement and 3D AOI after reflow on
every SMT line; work in progress waits on a rack with its lot card, never loose on a
bench.
Pack-out. Boards leave through OQC to AQL ANSI/ASQ Z1.4 (general inspection level II, single sampling, normal severity, AQL 0.65 for major defects) sampling, then
into a metallised static-shielding bag and a moisture-barrier bag with desiccant and
a humidity indicator card.
Solder-paste printing
The first gate is the one that decides the whole panel
Printing is where an SMT line succeeds or fails. Our GKG printers run vision alignment and closed-loop squeegee pressure, and a Koh Young 3D SPI station measures what actually landed on the pads.
- 3D SPI measures paste volume, area, height and alignment
- Out-of-tolerance prints trigger an automatic wipe and reprint
- Laser-cut and electroformed stencils, reported per panel
- Emergency stop and a guarded window at each operator position
SMT hall
Four views of a line that is running
Panorama, feeder bay, reflow exit and the work-in-progress rack, the four places a buyer asks to see on an audit.
Reel changeovers
Reel, cut tape, tube, tray and loose parts all load here; placement accuracy is held at ±25 µm.
8-12 zone profiles
Peak 245-260 °C, profiled per assembly and logged against the work order.
Racked, carded, counted
Every stack waits on a rack with its lot card; nothing sits loose on a bench between stages.
Named workstations
Four stations, four machine names
These are the stations a customer walks past on a visit, and the ones that carry the inspection evidence on the quality page.
MENTO MT2000
Runs on 100% of boards on every SMT line and checks missing parts, polarity, offset, tombstoning and joint shape.
JCX FAI830
The first board of a run is measured and photographed before the line is released to volume production.
Nordson DAGE XD7600NT
BGA, QFN and LGA joints are judged to J-STD-001 on a minimum of 5 boards per batch.
Hand-solder benches
ESD benches to ANSI/ESD S20.20 for touch-up, press-fit connectors, wiring and final assembly.
Through-hole zone
The back end is 4-5 DIP lines, not a corner bench
Through-hole work is a parallel production module with its own lines, its own soldering methods and its own inspection gate.
- 4-5 DIP insertion lines for radial, axial and connector work, with component height to 120 mm on the topside and 15 mm underneath through wave soldering.
- Wave soldering for classic through-hole volumes, with pallets fixtured per assembly rather than per family.
- Programmable selective soldering for mixed-technology boards where a connector sits close to SMT parts that cannot see a wave.
- Hand soldering and press-fit at ESD benches, judged to IPC-A-610 Class 2 and Class 3 depending on the build class you specify.
Assembly and dispatch
Where boards become finished goods
Hand-assembly lines, coated and potted units, and the finished-goods racks that feed dispatch.
Hand-assembly line, conformal coating 25-210 µm by chemistry, IPC-CC-830B
Assembly station, ultrasonic plus DI-water cleaning before final assembly
Finished goods, serialised where required, then bagged and boxed with dividers
Before you book a visit
The five questions audits always ask
Yes. Customer visits are routine, and we schedule them around your line of interest, SMT hall, DIP zone, inspection stations or dispatch. Send the dates you are considering and an engineer will confirm a slot and a walking route within one working day.
Resident inspection is arranged for series builds: your engineer signs off the first article against IPC-A-610 Class 2 or Class 3, watches the 3D AOI and X-ray gates, and co-signs the OQC sampling record before the cartons are sealed.
Photography of your own product, its fixtures and its test stations is allowed once an NDA is in place. We can sign an NDA covering non-use, non-disclosure and non-circumvention before any file or visit, and we do not photograph other customers' work.
The plant works to ANSI/ESD S20.20 with wrist straps, heel grounders, ESD flooring and grounded benches. Moisture-sensitive parts are stored below 40 °C and under 90% RH, and a part that has breached its floor life is baked at 125 °C , 9 hours for a saturated MSL 3 body of 1.4 mm or less.
Yes. There is no MOQ, order quantities start at 1 piece, and prototypes and series runs share the same nine SMT lines, the same 3D AOI gate and the same 3,072-point ICT or flying-probe programme. That is what keeps the first article and the fiftieth batch comparable.
Factory visit · 24-hour engineering review
Come and see the lines you are quoting
Tell us which process you want to inspect and an engineer will confirm a visit slot, or send your files and get a DFM review with the quotation.
