Process, quality and inspection

The numbers your design has to fit inside

The process windows we run, the quality system they sit under, and the inspection chain. Every figure comes from our own floor.

Certificates and audit bodies

Process window

The numbers your design has to fit inside

Solid bands are standard production. Outlined bands are quoted per project, with the stackup confirmed by an engineer before the purchase order.

In-house process window for PCB fabrication Four parameter lanes. Layer count: 1–2, 2–8 standard, 10–20 per project, 58 on request. Line and space: 2.5 mil HDI, 3 mil, 4 mil, 6 mil standard. Copper weight: 0.5 oz, 1–2 oz standard, 3–12 oz heavy copper, 20 oz. Board thickness: 0.4 mm, 0.8–1.6 mm standard, 2.0 mm, 3.2 mm. Solid bars are standard production, outlined bars are quoted per project. PROCESS WINDOW, SOLID = STANDARD PRODUCTION · OUTLINED = PER PROJECT LAYER COUNT 1–2 LAYERS 2–8 LAYERS · STANDARD 10–20 LAYERS · PER PROJECT 58 LAYERS · ON REQUEST LINE / SPACE 2.5 MIL · HDI 3 MIL 4 MIL 6 MIL = 0.15 MM · STANDARD COPPER WEIGHT 0.5 OZ 1–2 OZ · STANDARD 3–12 OZ · HEAVY COPPER 20 OZ = 700 µM BOARD THICKNESS 0.4 MM 0.8–1.6 MM · STANDARD 2.0 MM 3.2 MM STANDARD PRODUCTION QUOTED PER PROJECT OR ON REQUEST
In-house PCB and PCBA capability, verified in production
ParameterIn-house rangeNotes
Layer count1–582–8 layers are the standard production band; 10–20 layers and HDI are quoted per project; 58 layers on request
Min line / space2.5 mil2.5 mil on the HDI band, 6 mil (0.15 mm) is the cost-optimum standard; mechanical drill 0.2 mm, laser micro-via 0.1 mm (4 mil)
Copper thickness0.5–20 ozHeavy copper starts at 3 oz (105 µm); 20 oz equals 700 µm
Board size600 × 1200 mmMaximum working area; finished thickness 0.4–3.2 mm; annular ring 0.15 mm minimum
Placement rate80,000 CPHSingle-line capability on an ASM SIPLACE X4iS; Yamaha YSM20R rated 72,000 CPH. Real output depends on board mix and component count
Placement accuracy±25 µm01005 and 0201 passives through to BGA at 0.25 mm pitch; fine pitch to 0.3 mm; component height to 25 mm on SMT
Impedance control±10%±5% on premium builds; measured on board-edge TDR coupons, differential pairs to 100 Ω
Surface finishENIGNi 3–6 µm + Au 0.05–0.1 µm to IPC-4552; ENEPIG, OSP (0.2–0.5 µm, 6-month shelf life), immersion silver and tin, HASL, hard gold 150–200 HK25

Quality system

Certified, audited, and inspected ten times over

ISO 9001:2015 certified and audited annually by SGS, with UL 796 recognition for board manufacturing. Between incoming material and the shipping carton every order passes ten inspection gates.

ISO 9001:2015 certified UL 796 recognised RoHS & REACH compliant IPC-A-610 Class 2 & 3 workmanship J-STD-001 IPC-A-600 · IPC-6012 CE: supports your submission 3TG conflict-minerals policy

ISO 9001:2015

Certified by an accredited body and audited every year by SGS. The scope covers design, manufacturing, assembly and test, with an internal audit programme between the annual visits.

UL 796, recognised

Recognised for printed wiring board manufacturing, so your end product can carry the UL component recognition its own listing depends on.

RoHS & REACH, compliant

Lead-free production on all nine SMT lines. Per-board material declarations and test reports ship with the goods, backed by a 3TG conflict-minerals policy and CMRT on request.

IPC-A-610 Class 2 & 3 workmanship · J-STD-001 · IPC-A-600 / IPC-6012

Acceptance follows the standard that applies to each stage.

Bare board
IPC-A-600 · IPC-6012
Workmanship
IPC-A-610 Class 2 and Class 3 at final visual inspection
Solder joints
J-STD-001, including X-ray void criteria on hidden BGA, QFN and LGA joints
Membership
Active IPC member

Full scanned certificate package released on request. Automotive-grade work is quoted as process capability with PPAP and IMDS documentation, and medical-grade work with serialisation and full traceability to the lot. Every panel also passes AOI on all nine SMT lines (Omron VT-RNS or SAKI BF-18D), X-ray on a Nordson DAGE XD7600NT at a minimum of five pieces per lot, and electrical test on a Takaya APT-1500F flying probe or an Agilent i3070 ICT with 3,072 test points.

Quote in 24 h

Inspection chain

Ten gates between solder paste and the shipping carton

This is the difference between a quotation and a quality system: every gate below runs on production orders, not on samples, and every gate leaves a record you can ask for by serial number.

Ten-gate inspection chain from incoming material to traceability Gates one to five: incoming inspection, 3D solder paste inspection on a Koh Young printer, 3D automated optical inspection with Omron VT-RNS and SAKI BF-18D, digital X-ray on a Nordson DAGE XD7600NT, and flying probe on a Takaya APT-1500F. Gates six to ten: in-circuit test on an Agilent i3070 with 3,072 test points, functional test on a custom fixture, final visual inspection to IPC-A-610 Class 2 & 3 workmanship, outbound quality control sampled to AQL Z1.4 sample, and per-board traceability with 8D and CAPA follow-up. INSPECTION CHAIN, TEN GATES ON ALL NINE SMT LINES 01 IQC Bare board + coupon Component date codes 02 3D SPI Koh Young printer Volume · area · height 03 3D AOI Omron VT-RNS SAKI BF-18D · 100% 04 DIGITAL X-RAY Nordson DAGE XD7600NT J-STD-001 void criteria 05 FLYING PROBE Takaya APT-1500F Four heads · no fixture 06 ICT Agilent i3070 3,072 test points 07 FCT Custom test fixture Firmware + signals 08 FVI IPC-A-610 Class 2 & 3 workmanship Serial no. + photo file 09 OQC AQL Z1.4 sample Pack + CoC + report 10 TRACEABILITY Serialisation + records 8D / CAPA · monthly AOI 100% · X-RAY 5 PCS PER LOT · ICT 3,072 POINTS · OQC SAMPLED TO AQL Z1.4 sample
100% AOI · every board, all 9 SMT lines X-ray · minimum 5 pcs per lot ICT · 3,072 test points 3 independent inspections per board, minimum SPI data and AOI images on request 8D / CAPA on every escape